Skip to main content
Metal processing industry Circuit Foil Luxembourg S.à r.l.
Download this page as pdf
Description
manufacture of electrodeposited copper foil for printed circuitry
Certification
  • ISO 9001:2008 - renouvelé en 2006
  • ISO 14001:2004 pour la fabrication de la feuille de cuivre électrodéposé; BS OHSAS 18001:2007
Contact
Key figures
  • Foundation year 1961
  • National workforce 272
  • Share capital 35,071,800€
Management
  • M. Sang Beom Kim CEO
  • M. Junghyuk Cho CFO
Brands
  • Circuit Foil®
  • Doublethin®
  • IsoFoil 16 I®
  • EcoFoil®
Products
  • copper foil
  • electrodeposited for printed circuitry